All subsystems for Calyspo, except the student-led payload, have been built and tested or have been budgeted and will be purchased commercially. Calypso is being assembled around an off-the-shelf 1-Unit Cubesat Kit from Pumpkin, Inc. We purchased the cubesat after a Kickstarter campaign for a project experimenting with a solar sail. Because of the success of the Planetary Society’s Lightsail, we shelved that concept and began to look for a new project with the same goal: to study new cubesat propulsion systems for deep space exploration.

Some hardware we have on hand:

CubeSat Kit /dsPIC33 — solid-wall, 1U. Includes: Target-independent Components:

  • 710-00295 Cover Plate Assembly, solid-wall
  • 703-00243 Chassis Walls, solid-wall, 1U
  • 710-00293 Base Plate Assembly, solid-wall
  • 710-00300 Remove-Before-Flight Pin
  • 710-00297 Development Board
  • 710-00484 Motherboard
  • 632-00298 5V 4A External Power Supply
  • 632-00413 6-12V External Power Supply
  • 711-00303 Protoboard Kit
  • 615-00364 USB Cable
  • F/F DB9 Null-modem cable
  • Miscellaneous tools

Target-dependent Components:

  • 710-00540 JFPC-PIC24 Adapter
  • 633-00543 MPLAB-ICD3 USB In-circuit Debugger
  • 709-00363 Salvo Pro for PIC24 MCUs and dsPIC DSCs Software
  • 709-00569 Pumpkin PIC33 CubeSat Kit Software
  • 709-00580 EFFS-THIN SD Card Library
  • 710-00608 PSPM D (w/dsPIC33FJ256GP710)
  • 710-00528 PPM D2 (w/dsPIC33FJ256GP710)

To complete the base cubesat, we will need to integrate an ADCS (gravity gradient, magnetometer or reaction wheels) and a radio for communications. We plan to build these components in-house from designs that we currently have. The spacecraft will also need solar cells for power. This is dependent on the final selection of a mission profile because a LEO mission would allow us to utilize cheaper, non RAD-hard solar cells.

Our payload – the experimental propulsion system – will occupy an additional 2U of volume, including propellant tanks, pressurization and combustion chamber/nozzle assembly. Our current plan involves machining the chamber/nozzle from either Aluminum or Stainless Steel. These materials are most compatible with Hydrogen Peroxide. Other components will be purchased from commercial sources.